Innovative trends in the preparation process of tantalum targets

Innovative trends in the preparation process of tantalum targets include:
• Refined grain size The smaller the grain size of the target, the more uniform the thickness distribution of the sputtered film and the faster the sputtering rate.
• Composition control Accurately control the content of alloy elements to obtain alloy targets with uniform composition, reduce internal defects in the target, and inhibit material oxidation.
• Magnetic levitation melting technology Magnetic levitation melting technology is used to melt target alloys, and the melt is stirred by a magnetic field to ensure uniform alloy composition and avoid the high cost and low efficiency caused by the use of quartz crucibles.
• High-purity metal material preparation technology Improve the level of high-purity metal material preparation technology and achieve stable batch production.
• Intelligent production Overcome key technologies for high-performance target preparation (such as high-purity tantalum, tungsten targets, etc.) and drive intelligent production of targets.
• New material development Targeting the cutting-edge needs of electronic information technology, develop high-end new materials (such as ruthenium and ruthenium alloys, aluminum-scandium alloys, multi-element phase change alloys, cobalt-based special alloys, ceramic compounds and other high-purity material targets).
• Rapid densification forming and sintering technology Select forming and sintering technology that can achieve rapid densification to ensure low porosity of the target material and control the grain size. The introduction of impurity elements is strictly controlled during the preparation process.
• Improve analysis, detection and application evaluation capabilities Improve analysis, detection and application evaluation capabilities, and improve material standards and evaluation system construction.